Jiangsu GIS Laser Technologies Inc., fannie.tian@gis-group.com.cn 86--13625276829
Product Details
Place of Origin: Jiangsu, China
Brand Name: GIS
Certification: ISO 9001 CE
Model Number: DPX230
Payment & Shipping Terms
Minimum Order Quantity: 1 set
Price: negotiable price
Packaging Details: wooden case packing
Delivery Time: 20 work days
Supply Ability: 30set per month
Name: |
Laser Direct Imaging (LDI) |
Application: |
PCB HDI FPC |
Exposure Size Max: |
610x710mm |
Line Width: |
30μ |
Line Line Distance: |
10% |
Line Width Tolerance: |
10% |
Alignment Capability: |
24μm |
Laser Type: |
LD Laser, 405±5nm |
Efficient: |
30-40S@18"*24" |
Deviation Increase And Decrease: |
Fixed Increase And Contracton, Automatic Increase And Contraction, Interval Increase And Contraction, Partition Alignment |
File Format: |
Gerber 274X, ODB++ |
Name: |
Laser Direct Imaging (LDI) |
Application: |
PCB HDI FPC |
Exposure Size Max: |
610x710mm |
Line Width: |
30μ |
Line Line Distance: |
10% |
Line Width Tolerance: |
10% |
Alignment Capability: |
24μm |
Laser Type: |
LD Laser, 405±5nm |
Efficient: |
30-40S@18"*24" |
Deviation Increase And Decrease: |
Fixed Increase And Contracton, Automatic Increase And Contraction, Interval Increase And Contraction, Partition Alignment |
File Format: |
Gerber 274X, ODB++ |
laser direct imaging (LDI) system solutions for various PCB Multilayer
When Opt to LDI Technology?
Existing technologies are unable to offer acceptable solution and the inevitable results is reduced PCB production efficiency and lower yields. Nowadays, an average PCB trace width reaches 0.075mm (3mil) in complex multilayer PCBs. While photolithography imaging process unfortunately reached its limits due to creating high density interconnects on PCB. It is unable to creating PCB below 0.127/0.127mm (5/5mil) of trace widths and spaces. So, when most of the trace widths and spaces on a circuit board are smaller than 0.127/0.127mm (5/5mil), LDI is the best imaging option.
LDI technology is mainly used in HDI board manufacturing before. But now PCB manufacturers have to manufacture fine-line and ultra-fine-line conventional rigid, flex and rigid-flex PCBs with LDI technology where the trace widths and spaces of the conductive circuits are 0.075/0.075mm (3/3mil) or even 0.05/0.05mm (2/2mil). That’s because Laser Direct Imaging (LDI) has proved itself as the best and most comprehensive imaging solution for fine trace widths and spaces.
How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.
| Specification/model | DPX230 |
| Application | PCB,HDI,FPC (inner layer,outer layer,anti-welding) |
| Resolution (mass production) | 30um |
| Capacity | 30-40S@18"*24" |
| Exposure Size | 610*710mm |
| Panel thickness | 0.05mm-3.5mm |
| Alignment Mode | UV-Mark |
| Alignment capability | Outer layer±12um；Inner laye±24um |
| Line width tolerance | ±10% |
| Deviation increase and decrease mode | Fixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment |
| Laser type | LD Laser,405±5nm |
| File format | Gerber 274X；ODB++ |
| Power | 380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7% ~-10% |
| Condition | Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above; Vibration requirements to avoid violent vibration near the equipment |
About us
We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.
