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Laser Direct Imaging LDI Machine Flexible Board 260x810mm

Product Details

Place of Origin: Jiangsu, China

Brand Name: GIS

Certification: ISO 9001 CE

Model Number: RTR315

Payment & Shipping Terms

Minimum Order Quantity: 1 set

Price: negotiable price

Packaging Details: wooden case packing

Delivery Time: 20 work days

Supply Ability: 30set per month

Get Best Price
Product Details
Highlight:

FPC Laser Direct Imaging LDI Machine

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260mm LDI Machine

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FPC 810mm ldi imaging

Name:
Laser Direct Imaging (LDI)
Application:
PCB HDI FPC
Exposure Size Max:
260*810mm
Line Width:
15μ
Line Line Distance:
10%
Line Width Tolerance:
10%
Alignment Capability:
12/24μm
Laser Type:
LD Laser, 405±5nm
Efficient:
12S@18"*24"
Deviation Increase And Decrease:
Fixed Increase And Contracton, Automatic Increase And Contraction, Interval Increase And Contraction, Partition Alignment
File Format:
Gerber 274X, ODB++
Name:
Laser Direct Imaging (LDI)
Application:
PCB HDI FPC
Exposure Size Max:
260*810mm
Line Width:
15μ
Line Line Distance:
10%
Line Width Tolerance:
10%
Alignment Capability:
12/24μm
Laser Type:
LD Laser, 405±5nm
Efficient:
12S@18"*24"
Deviation Increase And Decrease:
Fixed Increase And Contracton, Automatic Increase And Contraction, Interval Increase And Contraction, Partition Alignment
File Format:
Gerber 274X, ODB++
Product Description

laser direct imaging (LDI) system solutions LDI Flexible Board

 

The interconnection complexity of HDI PCB is still growing today. Existing technologies are unable to offer acceptable solution for fine lines. But laser direct imaging technology is considered as an answer for this challenge.

 

In printed circuit board (PCB) manufacturing, the imaging process is what defines the copper circuit patterns. While the conventional imaging process adopts a photo-tool and UV light to transfer circuit images, LDI only uses a computer-controlled, highly focused, laser beam to directly define the circuit patterns on the PCB CCL copper layers with laser photoresist covered.


PCB laser direct imaging (LDI)
When fabricating a circuit board, the circuit traces are defined by what is the imaging process. Laser direct imaging ( LDI ) exposes the traces directly with a highly focused laser beam that in NC controlled, instead of flooded light passing through a photo tool, a laser beam will digitally create the image.


How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.

 

Specification/model  RTR315
Application PCB,HDI,FPC (inner layer,outer layer,anti-welding)
Resolution (mass production) 15um
Capacity 12S@18"*24"
Exposure Size 260*800mm
Panel thickness 0.05mm-3.5mm
Alignment Mode UV-Mark
Alignment capability Outer layer±12um;Inner laye±24um
Line width tolerance ±10%
Deviation increase and decrease mode Fixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment
Laser type LD Laser,405±5nm
File format Gerber 274X;ODB++
Power 380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7%     ~-10%
Condition Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above;
Vibration requirements to avoid violent vibration near the equipment                            


About us
We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.