Brand Name: | GIS Laser |
Model Number: | DPX220 |
MOQ: | 1 |
GIS Laser, a pioneering manufacturer of Advanced LDI Solutions, revolutionizes the industry with its DPX220, a testament to laser digital imaging technology's infinite potential. This state-of-the-art equipment seamlessly integrates data files, converting them into precise images and transmitting laser beams via DMD and lenses to achieve unparalleled results on carrier boards, soft boards, HDI boards, and multi-layer PCBs.
The DPX220 boasts an impressive exposure area of 610mm x 710mm, supporting full-panel stitching exposure, and accommodates thicknesses ranging from 0.05mm to 7mm, catering to a diverse array of manufacturing needs. Its precision is unmatched, offering a line width/line spacing (L/S) ratio of 20/20μm based on dry film, ensuring fine analytical quality that sets new standards in the industry.
Powered by DLP laser direct imaging technology, GIS Laser's DPX220 transcends traditional film or mask exposure methods. Equipped with proprietary motion systems and multi-wavelength lasers, this device delivers unparalleled precision, stability, and production efficiency. Its development of China's first 20-micron roll-to-roll DLP lithography equipment in 2021 underscores GIS Laser's commitment to innovation and technological excellence.
The DPX220's alignment accuracy of ±10μm for outer layers and ±20μm for inner layers, achieved through the innovative UV-Mark method, ensures consistent and reliable results. Its laser power is adjustable from 25W to 50W at 405nm, offering versatility to optimize processes for various applications.
Incorporating advanced scale modes, including fixed ratio, auto ratio, interval ratio, and partition ratio, the DPX220 seamlessly integrates into any production line, simplifying workflow and maximizing efficiency. Its support for Gerber274.xdx+ file format ensures seamless data transfer and processing, streamlining the entire manufacturing process.
Product Feature | Parameter |
---|---|
Applicable process | Inner, Outer, Ceramic Substrate |
Board thickness | 0.05~7mm |
Inner alignment accuracy | 20μm |
Laser power | 405 Nm/25-50 W(optional) |
File format | Gerber274x,odb++ |
Outer alignment accuracy | ±10μm |
Text information | Support The Board To Set Text And Serial Number And Other Traceable Information |
Line width tolerance | ±10% |
Effective exposure area | 610mm*710mm |
High sensing dry film | 35s@24"x18" |
GIS Laser's LDI Direct Printing Machine (Model: DPX220) is the perfect solution to your direct imaging needs. It offers high precision and accuracy of up to ±10μm and line width/line spacing of 20/20μm. The effective exposure area is 610mm*710mm and offers a line width tolerance of ±10%. It also supports the board to set text and serial number and other traceable information as needed. With GIS Laser's DPX230, you can get the perfect direct imaging solution that you need.
Moreover, GIS Laser's DPX220 offers MES functionality, enabling the setting of board numbers, serial numbers, and other traceable information, fostering a culture of transparency and accountability in the production environment.
With a portfolio of over a hundred patents granted globally, spanning China, the USA, Japan, Korea, and the EU, GIS Laser's DPX220 stands as a testament to its relentless pursuit of innovation and technological supremacy. This optimized technology and efficient industry solution redefine the possibilities of laser direct imaging, ushering in a new era of precision, productivity, and profitability for the PCB manufacturing industry.
Brand Name: | GIS Laser |
Model Number: | DPX220 |
MOQ: | 1 |
Packaging Details: | wooden case packing |
GIS Laser, a pioneering manufacturer of Advanced LDI Solutions, revolutionizes the industry with its DPX220, a testament to laser digital imaging technology's infinite potential. This state-of-the-art equipment seamlessly integrates data files, converting them into precise images and transmitting laser beams via DMD and lenses to achieve unparalleled results on carrier boards, soft boards, HDI boards, and multi-layer PCBs.
The DPX220 boasts an impressive exposure area of 610mm x 710mm, supporting full-panel stitching exposure, and accommodates thicknesses ranging from 0.05mm to 7mm, catering to a diverse array of manufacturing needs. Its precision is unmatched, offering a line width/line spacing (L/S) ratio of 20/20μm based on dry film, ensuring fine analytical quality that sets new standards in the industry.
Powered by DLP laser direct imaging technology, GIS Laser's DPX220 transcends traditional film or mask exposure methods. Equipped with proprietary motion systems and multi-wavelength lasers, this device delivers unparalleled precision, stability, and production efficiency. Its development of China's first 20-micron roll-to-roll DLP lithography equipment in 2021 underscores GIS Laser's commitment to innovation and technological excellence.
The DPX220's alignment accuracy of ±10μm for outer layers and ±20μm for inner layers, achieved through the innovative UV-Mark method, ensures consistent and reliable results. Its laser power is adjustable from 25W to 50W at 405nm, offering versatility to optimize processes for various applications.
Incorporating advanced scale modes, including fixed ratio, auto ratio, interval ratio, and partition ratio, the DPX220 seamlessly integrates into any production line, simplifying workflow and maximizing efficiency. Its support for Gerber274.xdx+ file format ensures seamless data transfer and processing, streamlining the entire manufacturing process.
Product Feature | Parameter |
---|---|
Applicable process | Inner, Outer, Ceramic Substrate |
Board thickness | 0.05~7mm |
Inner alignment accuracy | 20μm |
Laser power | 405 Nm/25-50 W(optional) |
File format | Gerber274x,odb++ |
Outer alignment accuracy | ±10μm |
Text information | Support The Board To Set Text And Serial Number And Other Traceable Information |
Line width tolerance | ±10% |
Effective exposure area | 610mm*710mm |
High sensing dry film | 35s@24"x18" |
GIS Laser's LDI Direct Printing Machine (Model: DPX220) is the perfect solution to your direct imaging needs. It offers high precision and accuracy of up to ±10μm and line width/line spacing of 20/20μm. The effective exposure area is 610mm*710mm and offers a line width tolerance of ±10%. It also supports the board to set text and serial number and other traceable information as needed. With GIS Laser's DPX230, you can get the perfect direct imaging solution that you need.
Moreover, GIS Laser's DPX220 offers MES functionality, enabling the setting of board numbers, serial numbers, and other traceable information, fostering a culture of transparency and accountability in the production environment.
With a portfolio of over a hundred patents granted globally, spanning China, the USA, Japan, Korea, and the EU, GIS Laser's DPX220 stands as a testament to its relentless pursuit of innovation and technological supremacy. This optimized technology and efficient industry solution redefine the possibilities of laser direct imaging, ushering in a new era of precision, productivity, and profitability for the PCB manufacturing industry.