Jiangsu GIS Laser Technologies Inc., fannie.tian@gis-group.com.cn 86--13625276829
Product Details
Place of Origin: Jiangsu, China
Brand Name: GIS
Certification: ISO 9001 CE
Model Number: DPX230
Payment & Shipping Terms
Minimum Order Quantity: 1 set
Price: negotiable price
Packaging Details: wooden case packing
Delivery Time: 20 work days
Supply Ability: 30set per month
Name: |
Laser Direct Imaging (LDI) |
Application: |
PCB HDI FPC |
Exposure Size Max: |
610*710mm |
Line Width: |
30μ |
Line Line Distance: |
10% |
Line Width Tolerance: |
10% |
Alignment Capability: |
24μm |
Laser Type: |
LD Laser, 405±5nm |
Efficient: |
30-40S@18"*24" |
Deviation Increase And Decrease: |
Fixed Increase And Contracton, Automatic Increase And Contraction, Interval Increase And Contraction, Partition Alignment |
File Format: |
Gerber 274X, ODB++ |
Name: |
Laser Direct Imaging (LDI) |
Application: |
PCB HDI FPC |
Exposure Size Max: |
610*710mm |
Line Width: |
30μ |
Line Line Distance: |
10% |
Line Width Tolerance: |
10% |
Alignment Capability: |
24μm |
Laser Type: |
LD Laser, 405±5nm |
Efficient: |
30-40S@18"*24" |
Deviation Increase And Decrease: |
Fixed Increase And Contracton, Automatic Increase And Contraction, Interval Increase And Contraction, Partition Alignment |
File Format: |
Gerber 274X, ODB++ |
laser direct imaging (LDI) system solutions for various PCB
Advantages
Eliminate the mask processes.
Save time and cost of loading and unloading masks.
Reduce the deviation caused by the expansion and contraction of masks.
High image resolution and high yield.
High-precision
Minimum resolution1.2μm, Minimum line width25μm(Depending on the configuration)
How does laser direct imaging ( LDI ) work?
Laser direct imaging needs a PCB with the photo-sensitive surface that is positioned under a computer controlled laser. And then the computer is creating the image on the board with the light of laser. A computer scans the board surface into a raster image, matching the raster image to a pre-loaded CAD or CAM design file that includes the specifications for the necessary image intended for the board, the laser is used for directly creating the image on the board.
| Specification/model | DPX230 |
| Application | PCB,HDI,FPC (inner layer,outer layer,anti-welding) |
| Resolution (mass production) | 30um |
| Capacity | 30-40S@18"*24" |
| Exposure Size | 610*710mm |
| Panel thickness | 0.05mm-3.5mm |
| Alignment Mode | UV-Mark |
| Alignment capability | Outer layer±12um；Inner laye±24um |
| Line width tolerance | ±10% |
| Deviation increase and decrease mode | Fixed increase and contraction, automatic increase and contraction, interval increase and contraction, partition alignment |
| Laser type | LD Laser,405±5nm |
| File format | Gerber 274X；ODB++ |
| Power | 380V three-phase alternating current, 6.4kW,50HZ, voltage fluctuation range + 7% ~-10% |
| Condition | Yellow light room; Temperature 22°C ± 1°C; Humidity 50% ± 5%; Cleanliness level 10000 and above; Vibration requirements to avoid violent vibration near the equipment |
About us
We are an innovative supplier of various PCB laser direct imaging (LDI) system solutions. Our system product portfolio ranges from LDI system configurations for high-mix and emerging PCB niche applications to fully automated LDI system solutions for mass production environments.
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