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Laser Direct Imaging PCB With Board Thickness 0.5~3.5mm For Outer Process

Product Details

Place of Origin: Suzhou, China

Brand Name: GIS

Model Number: DPX820SM

Payment & Shipping Terms

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Product Details
Highlight:

Outer Process LDI PCB

,

Laser Direct Imaging PCB 3.5mm

Board Thickness:
0.5~3.5mm
Application:
PCB、HDI、FPC
Solder Bridge/solder Opening:
50/75μm(process Condition)
Scale Mode:
White, Black, Yellow, Etc.
File Format:
File Format
Line Width Tolerance:
±10%
Applicable Process:
Solder Mask, Outer
Alignment Accuracy:
±12um
Board Thickness:
0.5~3.5mm
Application:
PCB、HDI、FPC
Solder Bridge/solder Opening:
50/75μm(process Condition)
Scale Mode:
White, Black, Yellow, Etc.
File Format:
File Format
Line Width Tolerance:
±10%
Applicable Process:
Solder Mask, Outer
Alignment Accuracy:
±12um
Product Description

Laser Direct Imaging PCB With Solder Mask Ink 30s@600x500mm(24"×20") Board Thickness 0.5~3.5mm For Outer Process

Product Description:

Laser Direct Imaging Printed Circuit Board (LDI PCB) is an advanced and efficient solution for PCB, HDI and FPC printing. Featuring an alignment accuracy of ±12um, it utilizes a 512W Mixing Wave Total Power to deliver outstanding performance. With an effective exposure area of 620x720mm (24"x28.5"), this product is capable of handling a wide range of PCB printing applications. Moreover, it supports a variety of file formats, including Gerber, DXF, etc., for maximum convenience. With its superior features, Laser Direct Imaging Print Board is the perfect solution for PCB printing.

 

Features:

  • Product Name: Laser Direct Imaging PCB
  • Laser power: Mixing Wave Total Power 512W
  • Effective exposure area: 620x720mm(24"x28.5")
  • Line width tolerance: ±10%
  • Solder Mask Color: Fixed Scale/ Auto Scale / Interval Scale / Partition Alignment
  • Alignment accuracy: ±12um
 

Technical Parameters:

Product Attributes Technical Parameters
Board thickness 0.5~3.5mm
Line width tolerance ±10%
Applicable process Solder Mask, Outer
File format File Format
Alignment method PAD (diameter: 0.5~3.0mm)
Alignment accuracy ±12um
Scale mode White, Black, Yellow, Etc.
Effective exposure area 620x720mm (24"x28.5")
Solder bridge/solder opening 50/75μm (process Condition)
Application PCB, HDI, FPC
 

Applications:

GIS Laser Direct Imaging PCB, Model DPX820SM is a high-precision circuit board produced in Suzhou, China. It features excellent solder bridge/solder opening of 50/75μm, and ±10% line width tolerance. With effective exposure area of 620x720mm (24"x28.5"), this laser direct imaging printed board has a mixing wave total power of 512W. Its applicable process includes solder mask and outer.

GIS Laser Direct Imaging PCB is ideal for use in various applications and scenarios. For instance, its superior imaging performance makes it the perfect choice for high-density and high-speed circuit board design. Its precise line width tolerance ensures excellent electrical performance. The laser direct imaging circuit board is also suitable for use in low-frequency RF circuits and other high-performance applications.

GIS Laser Direct Imaging PCB is the perfect solution for high-precision and high-performance circuit board design. With its advanced laser direct imaging technology, it is ideal for any application requiring precise imaging, superior electrical performance, and excellent solder bridge/solder opening. Get your GIS Laser Direct Imaging PCB and experience the outstanding performance of this cutting-edge circuit board solution.

 

Customization:

GIS Laser Direct Imaging PCB (Laser Direct Imaging Printed Circuit Board/ Laser Direct Imaging Printed Board) is a custom service for you. It is with the brand name GIS, model number DPX820SM and place of origin Suzhou, China. It supports File Format. And it has fixed scale/ auto scale/ interval scale/ partition alignment solder mask color, mixing wave total power 512W solder mask ink, and ±10% line width tolerance.

 

Packing and Shipping:

Packaging and Shipping for Laser Direct Imaging PCB

Laser Direct Imaging PCB is packaged and shipped in a manner that ensures it arrives safely and quickly. Each PCB is carefully inspected and tested before it is packaged and sent. The package is designed to protect the PCB during shipping and ensure it arrives in perfect condition.

The package is made with strong cardboard and has a protective foam insert to cushion the PCB against bumps and shocks. The package is then sealed with a tamper-evident seal to ensure it has not been opened or tampered with during transit. The package is labeled with the shipping address and a tracking number to enable tracking of the shipment.

Laser Direct Imaging PCB is shipped by a reliable and trusted shipping service. The shipping time depends on the location of the customer, but typically takes a few days.

 

FAQ:

Q1: What is laser direct imaging PCB?

A1: Laser direct imaging PCB is a kind of PCB fabrication process developed by GIS, which uses a laser beam to directly expose the image onto pre-sensitized copper clad laminate to make the circuit. It is suitable for small batch PCB production.

Q2: What is the model number of GIS's laser direct imaging PCB?

A2: GIS's laser direct imaging PCB is DPX820SM.

Q3: Where is GIS's laser direct imaging PCB made?

A3: GIS's laser direct imaging PCB is made in Suzhou, China.

Q4: What are the advantages of laser direct imaging PCB?

A4: The advantages of laser direct imaging PCB include high accuracy, high efficiency, high resolution, and no need of photosensitive film.

Q5: What are the applications of laser direct imaging PCB?

A5: Laser direct imaging PCB is widely used in small-batch PCB production, such as medical equipment, communication equipment, and consumer electronics.