Laser Direct Imaging Printed Circuit Board With 30s@600x500mm Solder Mask Ink

Laser Direct Imaging Printed Circuit Board With 30s@600x500mm Solder Mask Ink Scale Mode White And 512W Mixing Wave Tota

Product Description:

Laser Direct Imaging Printed Board (LDIPCB) is a cutting-edge technology for printing and imaging on printed circuit boards (PCBs). With LDIPCB, complex patterns can be printed with high accuracy and minimal disruption to the board. LDIPCB also offers enhanced reliability and performance in demanding applications.

LDIPCB offers a wide range of board thicknesses, from 0.5mm to 3.5mm. The alignment method is PAD, with diameters ranging from 0.5mm to 3.0mm. The solder mask ink is 30s@600x500mm(24, and the laser power is 512W of mixing wave total power. The line width tolerance is ±10%.

LDIPCB is a reliable, high-quality and cost-effective solution for the most demanding PCB printing and imaging applications. With its superior performance and accuracy, LDIPCB is the ideal choice for any project requiring precision and quality.

Features:

• Product Name: Laser Direct Imaging PCB
• Alignment method: PAD (diameter: 0.5~3.0mm)
• Application: PCB, HDI, FPC
• Board thickness: 0.5~3.5mm
• Scale mode: White, Black, Yellow, Etc.
• Effective exposure area: 620x720mm(24")

Technical Parameters:

Applications:

GIS DPX820SM Laser Direct Imaging PCB, produced in Suzhou, China, is a perfect solution for Printed Circuit Board (PCB), High-density Interconnect (HDI), and Flexible Printed Circuit (FPC) applications, due to its advanced laser direct imaging technology. It offers excellent performance with a minimum solder bridge/solder opening of 50/75μm, process conditions, scale mode of White, Black, Yellow, etc., and a board thickness of 0.5~3.5mm. Moreover, GIS DPX820SM Laser Direct Imaging PCB has an impressive alignment accuracy of ±12um, making it the ideal choice for LED applications.

Customization:

At GIS, we provide you with customized Laser Direct Imaging Printed Circuit Board (Laser Direct Imaging Printed Board or Laser Direct Imaging Circuit Board) services with a Brand Name of GIS and Model Number of DPX820SM. Our Place of Origin is Suzhou, China. We offer a Line Width Tolerance of ±10%, and our Board Thickness ranges from 0.5 to 3.5mm. We also provide services for Application such as PCB, HDI, and FPC. Our Solder Bridge/Solder Opening is 50/75μm (process Condition), and our Solder Mask Ink is 30s@600x500mm (24).

Support and Services:

At LDI, we provide our customers with high quality technical support and services for our Laser Direct Imaging PCBs. Our team of experts is available to provide guidance in the following areas:

• Design and production of laser direct imaging PCBs
• Installation and maintenance of laser direct imaging equipment
• Troubleshooting and repair of laser direct imaging systems
• Optimization of laser direct imaging processes
• Training and consultation for laser direct imaging

Our team of experts is available to assist you with any questions you may have regarding Laser Direct Imaging PCBs. If you have any questions or require assistance, please don’t hesitate to contact us.

Packing and Shipping:

Packaging and Shipping of Laser Direct Imaging PCB:

The Laser Direct Imaging PCB is securely packaged in anti-static packaging materials to protect it during transit. It is then shipped via an express shipping service such as FedEx, UPS, or DHL to ensure timely delivery.

FAQ:

Q: What is Laser Direct Imaging PCB?

A: Laser Direct Imaging PCB is a technology that uses a laser beam to directly expose PCB patterns on the substrate, eliminating the need for photolithography.

Q: What is the brand name of the product?

A: The brand name of the product is GIS.

Q: What is the model number of the product?

A: The model number of the product is DPX820SM.

Q: Where is the product made?

A: The product is made in Suzhou, China.

Q: What are the advantages of Laser Direct Imaging PCB?

A: Laser Direct Imaging PCB offers high imaging accuracy, fast imaging speed, and cost savings.