Brand Name: | GIS |
Model Number: | DPX725T |
LDI Equipment is a reliable and accurate solution for automated wire bonding, which provides the highest level of performance for a variety of processes. It is especially suitable for inner and outer wire bonding, offering an outer alignment accuracy of ±12um and a board thickness range from 0.1 to 3mm. It supports the Gerber274x and ODB++ file format and the effective exposure area is 635mm*810mm(25"×32"). The innovative design of the LDI Equipment guarantees perfect wire bonding with precise leadframe technology. The system is ideal for those looking to improve the efficiency and quality of their automated wire bonding process.
We ship LDI Equipment using sturdy corrugated boxes with foam inserts to ensure the equipment is well protected during transit. All shipments are tracked and customers will receive tracking information to follow their shipment. For international shipments, customers should expect their equipment to arrive within 2-4 weeks.
Brand Name: | GIS |
Model Number: | DPX725T |
LDI Equipment is a reliable and accurate solution for automated wire bonding, which provides the highest level of performance for a variety of processes. It is especially suitable for inner and outer wire bonding, offering an outer alignment accuracy of ±12um and a board thickness range from 0.1 to 3mm. It supports the Gerber274x and ODB++ file format and the effective exposure area is 635mm*810mm(25"×32"). The innovative design of the LDI Equipment guarantees perfect wire bonding with precise leadframe technology. The system is ideal for those looking to improve the efficiency and quality of their automated wire bonding process.
We ship LDI Equipment using sturdy corrugated boxes with foam inserts to ensure the equipment is well protected during transit. All shipments are tracked and customers will receive tracking information to follow their shipment. For international shipments, customers should expect their equipment to arrive within 2-4 weeks.